ZEISS Brings MicroCT and X-ray Microscopy Into One 3D Imaging Workflow

ZEISS is trying to make 3D X-ray inspection less of a compromise with its latest imaging system. The company has introduced ZEISS VersaXRM 5 Insight, a hybrid 3D X-ray microscope that combines microCT-style overview imaging with high-resolution X-ray microscopy on a single platform.

This is believed to be particularly useful in industrial inspection, where the feature that explains a failure is often buried inside a much larger component. The system uses ZEISS’s Resolution at a Distance (RaaD) technology to examine fine internal features in larger samples without requiring them to be cut, trimmed or refixtured. That opens up a more targeted approach to non-destructive inspection, particularly for components that are difficult or expensive to reproduce. 

ZEISS is also putting considerable emphasis on workflow along with resolution. Its ZEN NAV-X software provides guided scan and navigation workflows, while FAST Mode supports quicker 3D imaging for screening and positioning. AI-assisted, deep-learning reconstruction is intended to improve image quality and speed up the path from scan to usable information. 

The platform is designed for materials research, battery and energy-material analysis, semiconductor and electronics inspection, industrial failure analysis and life-sciences research. 

ZEISS highlights use cases ranging from internal battery structures to buried interconnects in advanced electronic packages.