Teledyne HiRel Adds Everspin MRAM to Aerospace and Defence Memory Portfolio
Everspin Technologies and Teledyne HiRel Semiconductors are joining forces to bring high-performance MRAM technology to aerospace and defence systems, where data reliability and long product...
Everspin Technologies and Teledyne HiRel Semiconductors are joining forces to bring high-performance MRAM technology to aerospace and defence systems, where data reliability and long product lifecycles are critical.
Under the partnership, Teledyne HiRel will add Everspin’s 256Mb PERSYST spin-transfer torque MRAM to its portfolio, with 64Mb and 128Mb versions also covered by the agreement. The memory technology is designed to combine the speed of conventional RAM with non-volatile storage, allowing data to remain intact during power loss, resets and unexpected system interruptions.
The partnership targets demanding applications including avionics, radar, electronic warfare systems, satellites, autonomous platforms and VPX-based computing systems. These applications increasingly require memory that can handle frequent data writes while maintaining reliable data retention over extended operating lifecycles.
A key advantage of MRAM is its potential to simplify system architecture. Unlike conventional memory arrangements that may require separate volatile memory, non-volatile storage and battery-backed protection, persistent MRAM can retain information without battery backup. This could make it particularly useful for event logging, system recovery, configuration storage and other functions where losing data during a power interruption is not an option.
Teledyne HiRel will provide qualification support, screening, procurement assistance and obsolescence management, an important factor for aerospace and defence programmes that often remain operational for decades.
The first PERSYST MRAM products under the partnership are expected to be available to customers in the fourth quarter of 2026. The move reflects growing interest in persistent memory technologies as system designers look for faster, more durable and power-loss-resistant alternatives for mission-critical electronics.





