Teledyne e2v Puts 3D Processing Inside the Camera With New Perciva ToF
Industrial 3D vision is moving closer to the machine. Teledyne e2v’s new Perciva ToF camera is built around that shift, combining depth sensing and on-camera processing in a package aimed […]
Industrial 3D vision is moving closer to the machine. Teledyne e2v’s new Perciva ToF camera is built around that shift, combining depth sensing and on-camera processing in a package aimed at logistics, robotics, inspection and factory safety applications.
The industrial-grade Time-of-Flight camera uses Teledyne e2v’s Hydra3D+ CMOS sensor, delivering 832 × 600-pixel 3D imaging. Its three-tap pixel architecture is designed to capture fast-moving objects without motion artefacts while maintaining sensitivity to low-reflectivity materials.
Perciva ToF is also designed to handle changing outdoor illumination and interference from other ToF systems without requiring cameras to be interconnected.
Instead of sending raw imaging data to an external processing system, Perciva ToF generates depth maps and point clouds directly on the camera and delivers them through GigE. Factory calibration and embedded processing are intended to reduce integration work for machine builders and system integrators.
The camera supports a 0.25–10 metre working range and 30 fps 3D imaging, with an IP67 enclosure for industrial environments. It also provides calibrated depth, confidence and amplitude data through its GigE interface, with a C++ SDK based on GenICam for integration into existing vision systems.
For Teledyne e2v, Perciva ToF extends a broader push toward smarter imaging hardware. The company has already built Hydra3D+ around real-time ToF sensing without motion artefacts; the new camera packages that capability into a deployable industrial vision system.


