First advanced 3D semiconductor packaging facility broke ground in Bhubaneswar. The ₹2,000 crore project brings glass substrate technology to domestic manufacturing—a first for commercial-scale production.
3D Glass Solutions, through its Indian subsidiary, will produce 70,000 glass panels annually, 50 million assembled units, and 13,000 advanced 3D heterogeneous integration modules. Glass substrates run faster and consume less power than plastic or ceramic—critical for AI, defense electronics, and 5G/6G systems.
Commercial production starts August 2028, full-scale output is expected to kick in by August 2030. The facility output with find usage across applications in data centers, machine learning, automotive radar, telecom networks, aerospace.
Advanced 3D packaging stacks multiple chips together, boosting performance while shrinking size. India lacked commercial capability in this domain until now. The facility handles both Advanced Trenched Micro-Packaging and embedded glass substrate manufacturing.
Odisha becomes the only state hosting both a compound semiconductor fab and a 3D packaging plant. The state’s pushing semiconductor policies to attract investment and build workforce through stipend-backed engineering programs. Jobs expected for engineers, diploma holders, and skilled workers.
