High-end intelligent automation equipment, solutions for semiconductor displays (LCD/OLED/CTP lamination, bonding, AOI inspection), intelligent automotive cockpits, semiconductor packaging and testing (die bonders, film laminating machines), and new-energy applications (battery cell and module PACK assembly lines), is the field Shenzhen Liande Automation Equipment Co., Ltd. leads. Founded in 1998 and headquartered in Shenzhen, the publicly listed high-tech enterprise (SZSE: 300545) pioneered China's high-end display-equipment industry, launching the global first curved-panel OCA lamination production line in Europe in 2020. With subsidiaries in Dongguan, Hengyang, Suzhou, Chengdu, and Romania, and R&D centers in Shenzhen and Japan, it serves global markets, holds more than 1,000 patents and certifications such as ISO 9001:2008, and has won awards such as the 'Top Ten Technological Innovations Award' at the World Display Industry Conference.