One Camera, One Full Wafer: Teledyne DALSA Takes Linea ML to 32k
The new top model in the Linea ML line scan range targets semiconductor wafer and electronics inspection. A full 300 mm wafer, inspected with a single camera, is the job […]
The new top model in the Linea ML line scan range targets semiconductor wafer and electronics inspection.
A full 300 mm wafer, inspected with a single camera, is the job Teledyne DALSA highlights for its new Linea ML 32K. The company announced the line scan camera from Waterloo, Canada. It says the camera’s small 2.5 µm pixels make it well suited to that task.
The 32K is now the highest-resolution option in the Linea ML range, which already offered 8k and 16k models.All models use a multiline CMOS sensor with optimized quantum efficiency. The sensor can be set up for single-line, dual-line, trilinear color or quadlinear multispectral imaging, depending on the application.
| Specification | Linea ML 32K |
| Pixel size | 2.5 µm |
| Maximum line rate | 150 kHz |
| Resolutions in the family | 8k, 16k, 32k |
| Interface | Camera Link HS, CX4 connectors for active optical cables |
Two features carry the defect-detection claim: HDR and sequential exposure. Teledyne DALSA says both improve the detection of small defects, and it also presents sequential exposure as a way to adapt the camera to varied inspection needs. The CX4 connectors take active optical cables, which the company says give the link complete immunity to electromagnetic interference.
Teledyne DALSA is part of Teledyne Technologies and sits within the Teledyne Vision Solutions group.
Image Source – Teledyne Technologies
