The power modules use IsoShield packaging—deliver 3x power density than discrete solutions while needing 70 percent less space.
The UCC34141-Q1 and UCC33420 modules copackage a planar transformer and isolated power stage, pushing 2W with reinforced isolation.
TI operates a 350-module power portfolio including MagPack integrated inductors. The launch addresses persistent industry challenge: packing more power into tighter spaces without compromising safety or thermal performance.
The modules support distributed power architectures and functional safety requirements while avoiding single-point failures. TI showcased the technology at the Applied Power Electronics Conference in San Antonio.
Target applications include data centre industry which is rapidly scaling to meet the AI compute demands and the growing EV industry where weight and size directly impact range.
